7025L20PFGB8 vs 7025L20JG8 feature comparison

7025L20PFGB8 Integrated Device Technology Inc

Buy Now Datasheet

7025L20JG8 Integrated Device Technology Inc

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description QFP, QCCJ,
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Date Of Intro 2018-01-26 2018-01-26
Access Time-Max 20 ns 20 ns
JESD-30 Code S-PQFP-G100 S-PQCC-J84
Memory Density 131072 bit 131072 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 100 84
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 8KX16 8KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QCCJ
Package Shape SQUARE SQUARE
Package Style FLATPACK CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Screening Level MIL-PRF-38535 Class Q
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form GULL WING J BEND
Terminal Position QUAD QUAD
Base Number Matches 1 1

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