7016L35JGB8
vs
7016S35JG8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
QCCJ,
QCCJ,
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
JESD-30 Code
S-PQCC-J68
S-PQCC-J68
JESD-609 Code
e3
e3
Length
24.2062 mm
24.2062 mm
Memory Density
147456 bit
147456 bit
Memory IC Type
DUAL-PORT SRAM
DUAL-PORT SRAM
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
68
68
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
16KX9
16KX9
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Screening Level
MIL-PRF-38535
Seated Height-Max
4.57 mm
4.57 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
24.2062 mm
24.2062 mm
Base Number Matches
1
1
Compare 7016L35JGB8 with alternatives
Compare 7016S35JG8 with alternatives