7016L12JG
vs
70T9169S12BF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
PLCC
CABGA
Package Description
0.950 X 0.950 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-68
,
Pin Count
68
100
Manufacturer Package Code
PLG68
BF100
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Date Of Intro
1996-03-01
Access Time-Max
12 ns
I/O Type
COMMON
JESD-30 Code
S-PQCC-J68
JESD-609 Code
e3
e0
Length
24.2062 mm
Memory Density
147456 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
9
Moisture Sensitivity Level
1
3
Number of Functions
1
Number of Ports
2
Number of Terminals
68
Number of Words
16384 words
Number of Words Code
16000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
16KX9
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
QCCJ
Package Equivalence Code
LDCC68,1.0SQ
Package Shape
SQUARE
Package Style
CHIP CARRIER
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
Seated Height-Max
4.57 mm
Standby Current-Max
0.005 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.275 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
J BEND
Terminal Pitch
1.27 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
24.2062 mm
Base Number Matches
5
2
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Compare 70T9169S12BF with alternatives