7008L55J
vs
IDT7008S55
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
PLCC
|
PGA
|
| Package Description |
1.150 X 1.150 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-84
|
1.12 X 1.12 INCH, 0.16 INCH HEIGHT, PGA-84
|
| Pin Count |
84
|
84
|
| Manufacturer Package Code |
PL84
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
55 ns
|
55 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
S-PQCC-J84
|
S-CPGA-P84
|
| JESD-609 Code |
e0
|
e0
|
| Length |
29.3116 mm
|
30.48 mm
|
| Memory Density |
524288 bit
|
524288 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
DUAL-PORT SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
|
| Number of Terminals |
84
|
84
|
| Number of Words |
65536 words
|
65536 words
|
| Number of Words Code |
64000
|
64000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
64KX8
|
64KX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
PGA
|
| Package Equivalence Code |
LDCC84,1.2SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
5.207 mm
|
| Standby Current-Max |
0.005 A
|
|
| Standby Voltage-Min |
4.5 V
|
|
| Supply Current-Max |
0.23 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
PIN/PEG
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
PERPENDICULAR
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
29.3116 mm
|
30.48 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 7008L55J with alternatives
Compare IDT7008S55 with alternatives