7008L55J
vs
IDT7008S55
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
PLCC
PGA
Package Description
1.150 X 1.150 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-84
1.12 X 1.12 INCH, 0.16 INCH HEIGHT, PGA-84
Pin Count
84
84
Manufacturer Package Code
PL84
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
JESD-30 Code
S-PQCC-J84
S-CPGA-P84
JESD-609 Code
e0
e0
Length
29.3116 mm
30.48 mm
Memory Density
524288 bit
524288 bit
Memory IC Type
MULTI-PORT SRAM
DUAL-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Ports
2
Number of Terminals
84
84
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64KX8
64KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCJ
PGA
Package Equivalence Code
LDCC84,1.2SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
5.207 mm
Standby Current-Max
0.005 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.23 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
J BEND
PIN/PEG
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
PERPENDICULAR
Time@Peak Reflow Temperature-Max (s)
30
Width
29.3116 mm
30.48 mm
Base Number Matches
17
24
Compare 7008L55J with alternatives
Compare IDT7008S55 with alternatives