7008L55J vs 7008L55JG8 feature comparison

7008L55J Integrated Device Technology Inc

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7008L55JG8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PLCC
Package Description 1.150 X 1.150 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-84 QCCJ,
Pin Count 84
Manufacturer Package Code PL84
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
I/O Type COMMON
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0
Length 29.3116 mm
Memory Density 524288 bit 524288 bit
Memory IC Type MULTI-PORT SRAM DUAL-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Ports 2
Number of Terminals 84 84
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX8 64KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 4.57 mm
Standby Current-Max 0.005 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.23 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 29.3116 mm
Base Number Matches 17 1

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Compare 7008L55JG8 with alternatives