7006S55F vs 7006S55FGB feature comparison

7006S55F Integrated Device Technology Inc

Buy Now Datasheet

7006S55FGB Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description QFF, QFL68,.95SQ QFP-68
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
I/O Type COMMON COMMON
JESD-30 Code S-PQFP-F68 S-PQCC-J68
JESD-609 Code e0 e3
Memory Density 131072 bit 131072 bit
Memory IC Type APPLICATION SPECIFIC SRAM MULTI-PORT SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 68 68
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 16KX8 16KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFF QCCJ
Package Equivalence Code QFL68,.95SQ QFL68,.95SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.015 A 0.03 A
Standby Voltage-Min 4.5 V 4.5 V
Supply Current-Max 0.335 mA 0.3 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD MATTE TIN
Terminal Form FLAT J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Base Number Matches 1 1
Part Package Code QFP
Pin Count 68
Screening Level MIL-PRF-38535

Compare 7006S55F with alternatives

Compare 7006S55FGB with alternatives