7006S55F
vs
7006S55FGB
feature comparison
All Stats
Differences Only
Pbfree Code
No
Yes
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
QFF, QFL68,.95SQ
QFP-68
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PQFP-F68
S-PQCC-J68
JESD-609 Code
e0
e3
Memory Density
131072 bit
131072 bit
Memory IC Type
APPLICATION SPECIFIC SRAM
MULTI-PORT SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
68
68
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
16KX8
16KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFF
QCCJ
Package Equivalence Code
QFL68,.95SQ
QFL68,.95SQ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.015 A
0.03 A
Standby Voltage-Min
4.5 V
4.5 V
Supply Current-Max
0.335 mA
0.3 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
FLAT
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Base Number Matches
1
1
Part Package Code
QFP
Pin Count
68
Screening Level
MIL-PRF-38535
Compare 7006S55F with alternatives
Compare 7006S55FGB with alternatives