7006S55FGB
vs
7006L55F
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
Package Description
QFP-68
QFF, QFL68,.95SQ
Pin Count
68
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PQCC-J68
S-PQFP-F68
JESD-609 Code
e3
e0
Memory Density
131072 bit
131072 bit
Memory IC Type
MULTI-PORT SRAM
APPLICATION SPECIFIC SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
68
68
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
16KX8
16KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QFF
Package Equivalence Code
QFL68,.95SQ
QFL68,.95SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
Standby Current-Max
0.03 A
0.0015 A
Standby Voltage-Min
4.5 V
2 V
Supply Current-Max
0.3 mA
0.285 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
J BEND
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Base Number Matches
1
1
Compare 7006S55FGB with alternatives
Compare 7006L55F with alternatives