7006S55F vs IDT7133LA35JB feature comparison

7006S55F Integrated Device Technology Inc

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IDT7133LA35JB Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description QFF, QFL68,.95SQ PLASTIC, LCC-68
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 35 ns
I/O Type COMMON COMMON
JESD-30 Code S-PQFP-F68 S-PQCC-J68
JESD-609 Code e0 e0
Memory Density 131072 bit 32768 bit
Memory IC Type APPLICATION SPECIFIC SRAM MULTI-PORT SRAM
Memory Width 8 16
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 68 68
Number of Words 16384 words 2048 words
Number of Words Code 16000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 16KX8 2KX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFF QCCJ
Package Equivalence Code QFL68,.95SQ LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.015 A 0.004 A
Standby Voltage-Min 4.5 V 2 V
Supply Current-Max 0.335 mA 0.295 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form FLAT J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Base Number Matches 15 1
Part Package Code LCC
Pin Count 68
Length 24.2062 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 225
Screening Level MIL-PRF-38535
Seated Height-Max 4.572 mm
Time@Peak Reflow Temperature-Max (s) 20
Width 24.2062 mm

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