7005S70PFGB
vs
TSMIX67V05
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
TEMIC SEMICONDUCTORS
Part Package Code
QFP
Package Description
QFP, QFP64,.66SQ,32
Pin Count
64
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
70 ns
55 ns
I/O Type
COMMON
JESD-30 Code
S-PQFP-G64
R-PQFP-G64
JESD-609 Code
e3
Memory Density
65536 bit
65536 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Ports
2
Number of Terminals
64
64
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
8KX8
8KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Equivalence Code
QFP64,.66SQ,32
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.03 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.3 mA
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
3
1
Category CO2 Kg
12
Compliance Temperature Grade
Industrial: -40C to +85C
Compare 7005S70PFGB with alternatives
Compare TSMIX67V05 with alternatives