68681/BQA
vs
SCC2692AE1F40
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS COMPONENTS
Part Package Code
DIP
Package Description
CERAMIC, DIP-40
,
Pin Count
40
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
4
Boundary Scan
NO
NO
Bus Compatibility
6800
Clock Frequency-Max
4 MHz
3.6864 MHz
Communication Protocol
ASYNC, BIT; BISYNC
ASYNC, BIT
Data Encoding/Decoding Method
NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL (MANCHESTER)
NRZ
Data Transfer Rate-Max
0.125 MBps
0.125 MBps
External Data Bus Width
8
8
JESD-30 Code
R-GDIP-T40
R-CDIP-T40
Low Power Mode
NO
NO
Number of DMA Channels
Number of I/O Lines
14
Number of Serial I/Os
2
2
Number of Terminals
40
40
On Chip Data RAM Width
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
5.715 mm
Supply Current-Max
150 mA
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
MOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
1
1
Compare 68681/BQA with alternatives
Compare SCC2692AE1F40 with alternatives