6116LA25Y vs U630H16BSA35G1 feature comparison

6116LA25Y Integrated Device Technology Inc

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U630H16BSA35G1 Cypress Semiconductor

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC SIMTEK CORP
Part Package Code SOJ SOIC
Package Description 0.300 INCH, SOJ-24 SOP, SOP28,.4
Pin Count 24 28
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 35 ns
I/O Type COMMON
JESD-30 Code R-PDSO-J24 R-PDSO-G28
JESD-609 Code e0 e3
Memory Density 16384 bit 16384 bit
Memory IC Type STANDARD SRAM NON-VOLATILE SRAM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 24 28
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Organization 2KX8 2KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOJ SOP
Package Equivalence Code SOJ24,.34 SOP28,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 260
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.00003 A 0.002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.11 mA 0.085 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL AUTOMOTIVE
Terminal Finish TIN LEAD MATTE TIN
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 15 1
Pbfree Code Yes
Length 17.9 mm
Seated Height-Max 2.65 mm
Width 7.5 mm

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Compare U630H16BSA35G1 with alternatives