5AGXMA3D4F31I5N
vs
5AGXMA3D4F31C5N
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
FBGA-896
|
FBGA-896
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
622 MHz
|
|
| JESD-30 Code |
S-PBGA-B896
|
S-PBGA-B896
|
| JESD-609 Code |
e1
|
e1
|
| Length |
31 mm
|
31 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
5890
|
5890
|
| Number of Inputs |
416
|
416
|
| Number of Logic Cells |
156000
|
156000
|
| Number of Outputs |
416
|
416
|
| Number of Terminals |
896
|
896
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
5890 CLBS
|
5890 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
HBGA
|
| Package Equivalence Code |
BGA896,30X30,40
|
BGA896,30X30,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.7 mm
|
2.7 mm
|
| Supply Voltage-Max |
1.13 V
|
1.13 V
|
| Supply Voltage-Min |
1.07 V
|
1.07 V
|
| Supply Voltage-Nom |
1.1 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
31 mm
|
31 mm
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
Intel
|
|
|
|
Compare 5AGXMA3D4F31I5N with alternatives
Compare 5AGXMA3D4F31C5N with alternatives