5AGXMA3D4F31C5N
vs
5AGXMA3D4F31C5
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
| Package Description |
FBGA-896
|
BGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
|
| JESD-30 Code |
S-PBGA-B896
|
S-PBGA-B896
|
| JESD-609 Code |
e1
|
e0
|
| Length |
31 mm
|
31 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
5890
|
|
| Number of Inputs |
416
|
|
| Number of Logic Cells |
156000
|
|
| Number of Outputs |
416
|
|
| Number of Terminals |
896
|
896
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
5890 CLBS
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HBGA
|
BGA
|
| Package Equivalence Code |
BGA896,30X30,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
2.7 mm
|
2.7 mm
|
| Supply Voltage-Max |
1.13 V
|
1.13 V
|
| Supply Voltage-Min |
1.07 V
|
1.07 V
|
| Supply Voltage-Nom |
1.1 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
31 mm
|
31 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
896
|
| Clock Frequency-Max |
|
622 MHz
|
|
|
|
Compare 5AGXMA3D4F31C5N with alternatives