5AGXMA3D4F31I3G
vs
5AGXMA3D4F31I3
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
FBGA-896
BGA,
Reach Compliance Code
compliant
compliant
ECCN Code
3A991
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Intel
JESD-30 Code
S-PBGA-B896
S-PBGA-B896
Length
31 mm
31 mm
Number of CLBs
5890
Number of Inputs
416
Number of Logic Cells
156000
Number of Outputs
416
Number of Terminals
896
896
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Organization
5890 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HBGA
BGA
Package Equivalence Code
BGA896,30X30,40
BGA896,30X30,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
2.7 mm
2.7 mm
Supply Voltage-Max
1.18 V
1.18 V
Supply Voltage-Min
1.12 V
1.12 V
Supply Voltage-Nom
1.15 V
1.15 V
Surface Mount
YES
YES
Technology
TSMC
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
31 mm
31 mm
Base Number Matches
1
2
Pbfree Code
No
Part Package Code
BGA
Pin Count
896
Clock Frequency-Max
670 MHz
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare 5AGXMA3D4F31I3G with alternatives
Compare 5AGXMA3D4F31I3 with alternatives