Findchips: Compare 5AGXMA3D4F31I3G vs 5AGXMA3D4F31I3P

5AGXMA3D4F31I3G vs 5AGXMA3D4F31I3P feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes
Part Life Cycle Code	Active	Active
Ihs Manufacturer	INTEL CORP	INTEL CORP
Package Description	FBGA-896	FBGA-896
Reach Compliance Code	compliant	compliant
ECCN Code	3A991
HTS Code	8542.39.00.01	8542.39.00.01
Samacsys Manufacturer	Intel
JESD-30 Code	S-PBGA-B896	S-PBGA-B896
Length	31 mm	31 mm
Number of CLBs	5890	5890
Number of Inputs	416	416
Number of Logic Cells	156000	156000
Number of Outputs	416	416
Number of Terminals	896	896
Operating Temperature-Max	100 °C	100 °C
Operating Temperature-Min	-40 °C	-40 °C
Organization	5890 CLBS	5890 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	HBGA	HBGA
Package Equivalence Code	BGA896,30X30,40	BGA896,30X30,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max	2.7 mm	2.7 mm
Supply Voltage-Max	1.18 V	1.18 V
Supply Voltage-Min	1.12 V	1.12 V
Supply Voltage-Nom	1.15 V	1.15 V
Surface Mount	YES	YES
Technology	TSMC	TSMC
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	31 mm	31 mm
Base Number Matches	1	1
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays