5962R9957401QXC vs 5962-9957401QXX feature comparison

5962R9957401QXC AMD Xilinx

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5962-9957401QXX AMD Xilinx

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code CGA BGA
Package Description HCGA, BGA,
Pin Count 560 560
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-CBGA-X560 S-CBGA-B560
JESD-609 Code e0
Length 42.5 mm 42.5 mm
Number of CLBs 6144
Number of Equivalent Gates 1124022 1124022
Number of Terminals 560 560
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 6144 CLBS, 1124022 GATES 1124022 GATES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code HCGA BGA
Package Equivalence Code CGA560,33X33,50 CGA560,33X33,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class Q
Seated Height-Max 4.9 mm 5.35 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form UNSPECIFIED BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Total Dose 100k Rad(Si) V
Width 42.5 mm 42.5 mm
Base Number Matches 1 1

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Compare 5962-9957401QXX with alternatives