5962-9957401QXX vs XQV1000-4CG560M feature comparison

5962-9957401QXX AMD Xilinx

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XQV1000-4CG560M AMD Xilinx

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA CGA
Package Description BGA, CERAMIC, CGA-560
Pin Count 560 560
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-CBGA-B560 S-CBGA-X560
Length 42.5 mm 42.5 mm
Number of Equivalent Gates 1124022 1124022
Number of Terminals 560 560
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 1124022 GATES 6144 CLBS, 1124022 GATES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA HCGA
Package Equivalence Code CGA560,33X33,50 CGA560,33X33,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, HEAT SINK/SLUG
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.35 mm 4.9 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form BALL UNSPECIFIED
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Rohs Code No
Combinatorial Delay of a CLB-Max 0.8 ns
JESD-609 Code e0
Number of CLBs 6144
Number of Inputs 404
Number of Logic Cells 27648
Number of Outputs 404
Screening Level MIL-PRF-38535
Terminal Finish TIN LEAD

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Compare XQV1000-4CG560M with alternatives