5962R9957401QXA vs XQVR1000-4CG560M feature comparison

5962R9957401QXA AMD Xilinx

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XQVR1000-4CG560M AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA CGA
Package Description BGA, CGA560,33X33,50 HEAT SINK, CERAMIC, CGA-560
Pin Count 560 560
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-CBGA-B560 S-CBGA-X560
JESD-609 Code e0
Length 42.5 mm 42.5 mm
Number of Equivalent Gates 1124022 1124022
Number of Inputs 404 404
Number of Logic Cells 27648 27648
Number of Outputs 404 404
Number of Terminals 560 560
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 1124022 GATES 6144 CLBS, 1124022 GATES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA HCGA
Package Equivalence Code CGA560,33X33,50 CGA560,33X33,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, HEAT SINK/SLUG
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class Q
Seated Height-Max 5.35 mm 4.9 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form BALL UNSPECIFIED
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Total Dose 100k Rad(Si) V 100k Rad(Si) V
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Number of CLBs 6144
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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