5962R9666301TXX
vs
HS9-26C31RH-8
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTERSIL CORP
|
| Package Description |
DFP,
|
DFP, FL16,.3
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
4
|
4
|
| Input Characteristics |
STANDARD
|
STANDARD
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
EIA-422
|
EIA-422
|
| JESD-30 Code |
R-CDFP-F16
|
R-CDFP-F16
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class T
|
MIL-PRF-38535 Class Q
|
| Seated Height-Max |
2.92 mm
|
2.92 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Total Dose |
100k Rad(Si) V
|
300k Rad(Si) V
|
| Width |
6.73 mm
|
6.73 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DFP
|
| Pin Count |
|
16
|
| High Level Input Current-Max |
|
0.000001 A
|
| JESD-609 Code |
|
e0
|
| Out Swing-Min |
|
2 V
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
FL16,.3
|
| Receive Delay-Max |
|
|
| Terminal Finish |
|
TIN LEAD
|
| Transmit Delay-Max |
|
22 ns
|
|
|
|
Compare 5962R9666301TXX with alternatives
Compare HS9-26C31RH-8 with alternatives