5962R9662104VCX
vs
HEF4011UBDB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP,
DIP,
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-CDIP-T14
R-GDIP-T14
JESD-609 Code
e4
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
338 ns
120 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class V
Supply Voltage-Max (Vsup)
18 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Total Dose
100k Rad(Si) V
Base Number Matches
2
1
Load Capacitance (CL)
50 pF
Seated Height-Max
5.08 mm
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 5962R9662104VCX with alternatives
Compare HEF4011UBDB with alternatives