5962R9662104VCX
vs
TC4011UBP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
TOSHIBA CORP
Package Description
DIP,
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-CDIP-T14
R-PDIP-T14
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
338 ns
110 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Total Dose
100k Rad(Si) V
Base Number Matches
2
1
Pbfree Code
No
Rohs Code
No
Part Package Code
DIP
Pin Count
14
JESD-609 Code
e0
Length
19.25 mm
Load Capacitance (CL)
50 pF
Package Equivalence Code
DIP14,.3
Seated Height-Max
4.45 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 5962R9662104VCX with alternatives
Compare TC4011UBP with alternatives