5962R9582901VEC
vs
CD4010BFMSR
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
INTERSIL CORP
|
| Package Description |
,
|
DIP, DIP16,.3
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR
|
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-GDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e4
|
e0
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Number of Functions |
6
|
6
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Propagation Delay (tpd) |
175.5 ns
|
270 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
GOLD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Total Dose |
100k Rad(Si) V
|
100k Rad(Si) V
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
16
|
| Length |
|
19.05 mm
|
| Max I(ol) |
|
0.00035999999999999997 A
|
| Package Equivalence Code |
|
DIP16,.3
|
| Prop. Delay@Nom-Sup |
|
270 ns
|
| Schmitt Trigger |
|
NO
|
| Screening Level |
|
MIL-PRF-38535 Class V
|
| Seated Height-Max |
|
0.8 mm
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
7.62 mm
|
|
|
|
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