5962R9582602V9X
vs
HEF4001BT-T
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTERSIL CORP
NXP SEMICONDUCTORS
Part Package Code
DIE
SOIC
Package Description
DIE,
SOP,
Pin Count
14
14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
X-XUUC-N14
R-PDSO-G14
Logic IC Type
NOR GATE
NOR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
SOP
Package Equivalence Code
DIE OR CHIP
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE
Propagation Delay (tpd)
338 ns
120 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
18 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Total Dose
100k Rad(Si) V
Base Number Matches
1
2
Pbfree Code
Rohs Code
JESD-609 Code
e4
Length
8.65 mm
Load Capacitance (CL)
50 pF
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.75 mm
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9 mm
Compare 5962R9582602V9X with alternatives
Compare HEF4001BT-T with alternatives