5962R9578401VEX
vs
54HSC74NS
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
GEC PLESSEY SEMICONDUCTORS
Package Description
DIP,
DIE,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HSC
JESD-30 Code
R-CDIP-T16
X-XUUC-N
Length
19.05 mm
Logic IC Type
J-KBAR FLIP-FLOP
D FLIP-FLOP
Number of Bits
2
1
Number of Functions
2
2
Number of Terminals
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
DIP
DIE
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
IN-LINE
UNCASED CHIP
Propagation Delay (tpd)
35 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
UPPER
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
Base Number Matches
3
1
Part Package Code
DIE
Additional Feature
RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
Package Equivalence Code
DIE OR CHIP
Compare 5962R9578401VEX with alternatives
Compare 54HSC74NS with alternatives