54HSC74NS
vs
54HSC109FD
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GEC PLESSEY SEMICONDUCTORS
GEC PLESSEY SEMICONDUCTORS
Part Package Code
DIE
Package Description
DIE,
,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
Family
HSC
HSC
JESD-30 Code
X-XUUC-N
R-CDFP-F16
Logic IC Type
D FLIP-FLOP
J-KBAR FLIP-FLOP
Number of Bits
1
2
Number of Functions
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIE
DFP
Package Equivalence Code
DIE OR CHIP
FL16,.3
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
FLATPACK
Propagation Delay (tpd)
25 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
FLAT
Terminal Position
UPPER
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Base Number Matches
1
1
Load Capacitance (CL)
50 pF
Number of Terminals
16
Compare 54HSC74NS with alternatives
Compare 54HSC109FD with alternatives