5962R0422903VZA vs 5962R0422903QXC feature comparison

5962R0422903VZA Cobham PLC

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5962R0422903QXC Cobham Semiconductor Solutions

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer COBHAM PLC AEROFLEX COLORADO SPRINGS
Package Description LGA, CERAMIC, QFP-208
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 1.01 ns 1.01 ns
JESD-30 Code S-CBGA-N484 S-CQFP-F208
JESD-609 Code e0 e4
Length 29 mm 27.991 mm
Number of CLBs 1536 1536
Number of Equivalent Gates 320640 320640
Number of Terminals 484 208
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 1536 CLBS, 320640 GATES 1536 CLBS, 320640 GATES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code LGA QFF
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class V MIL-PRF-38535 Class Q
Seated Height-Max 2.95 mm 3.302 mm
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.3 V 2.3 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD GOLD
Terminal Form NO LEAD FLAT
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position BOTTOM QUAD
Total Dose 100k Rad(Si) V 100k Rad(Si) V
Width 29 mm 27.991 mm
Base Number Matches 2 2
Part Package Code QFP
Pin Count 208
Package Equivalence Code TPAK208,2.9SQ,20

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