5962H9659601VCX
vs
5962H9659601QXX
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
AEROFLEX COLORADO SPRINGS
|
AEROFLEX COLORADO SPRINGS
|
| Part Package Code |
DIP
|
DFP
|
| Package Description |
DIP,
|
DFP,
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
AC
|
AC
|
| JESD-30 Code |
R-CDIP-T14
|
R-CDFP-F14
|
| JESD-609 Code |
e0/e4
|
e0/e4
|
| Length |
19.43 mm
|
9.525 mm
|
| Logic IC Type |
NOR GATE
|
NOR GATE
|
| Number of Functions |
2
|
2
|
| Number of Inputs |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Propagation Delay (tpd) |
14 ns
|
14 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class V
|
MIL-PRF-38535 Class Q
|
| Seated Height-Max |
5.08 mm
|
2.921 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD/GOLD
|
TIN LEAD/GOLD
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Total Dose |
1M Rad(Si) V
|
1M Rad(Si) V
|
| Width |
7.62 mm
|
6.2865 mm
|
| Base Number Matches |
1
|
1
|
| Package Equivalence Code |
|
FL14,.3
|
|
|
|
Compare 5962H9659601VCX with alternatives
Compare 5962H9659601QXX with alternatives