5962H9563801QYA
vs
5962H9563801VYC
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
AEROFLEX MICROELECTRONIC SOLUTIONS
|
AEROFLEX MICROELECTRONIC SOLUTIONS
|
Package Description |
GQFF, TPAK44,1.67,25
|
GQFF, TPAK44,1.67,25
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.1.A
|
3A001.A.1.A
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Bit Size |
8
|
8
|
CPU Family |
8051
|
8051
|
JESD-30 Code |
R-XQFP-F44
|
R-XQFP-F44
|
Number of Terminals |
44
|
44
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC
|
CERAMIC
|
Package Code |
GQFF
|
GQFF
|
Package Equivalence Code |
TPAK44,1.67,25
|
TPAK44,1.67,25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK, GUARD RING
|
FLATPACK, GUARD RING
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
256
|
256
|
Screening Level |
38535Q/M;38534H;883B
|
38535V;38534K;883S
|
Speed |
20 MHz
|
20 MHz
|
Supply Current-Max |
120 mA
|
120 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
QUAD
|
QUAD
|
Total Dose |
1M Rad(Si) V
|
1M Rad(Si) V
|
Base Number Matches |
4
|
4
|
|
|
|