5962F9951101QXX
vs
5962F9951101VXX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
INTERSIL CORP
Package Description
DFP,
DFP,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
High Side Driver
YES
YES
Interface IC Type
BUFFER OR INVERTER BASED MOSFET DRIVER
BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 Code
R-CDFP-F16
R-CDFP-F16
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Peak Current Limit-Nom
2 A
2 A
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
MIL-PRF-38535 Class V
Seated Height-Max
2.92 mm
2.92 mm
Supply Voltage-Max
18 V
18 V
Supply Voltage-Min
12 V
12 V
Surface Mount
YES
YES
Technology
BICMOS
BICMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Total Dose
300k Rad(Si) V
300k Rad(Si) V
Turn-off Time
0.25 µs
0.25 µs
Turn-on Time
0.25 µs
0.25 µs
Width
6.73 mm
6.73 mm
Base Number Matches
2
2
Part Package Code
DFP
Pin Count
16
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