5962F9666302VEC
vs
5962F9666302V9X
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
INTERSIL CORP
Package Description
DIP,
DIE,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Differential Output
YES
YES
Driver Number of Bits
4
4
Input Characteristics
STANDARD
STANDARD
Interface IC Type
LINE DRIVER
LINE DRIVER
Interface Standard
EIA-422
EIA-422
JESD-30 Code
R-CDIP-T16
R-XUUC-N16
JESD-609 Code
e4
Number of Functions
4
4
Number of Terminals
16
16
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
DIP
DIE
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
UNCASED CHIP
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class V
MIL-PRF-38535 Class V
Seated Height-Max
5.08 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Finish
GOLD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
UPPER
Total Dose
300k Rad(Si) V
300k Rad(Si) V
Transmit Delay-Max
42 ns
Width
7.62 mm
Base Number Matches
2
2
Part Package Code
DIE
Pin Count
16
Compare 5962F9666302VEC with alternatives
Compare 5962F9666302V9X with alternatives