5962F7802301MEX vs DS26LS31MJFQML feature comparison

5962F7802301MEX National Semiconductor Corporation

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DS26LS31MJFQML Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TEXAS INSTRUMENTS INC
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output YES YES
Driver Number of Bits 4 4
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422; FED STD 1020 EIA-422; FED STD 1020
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Length 19.43 mm 19.94 mm
Number of Functions 4 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Total Dose 300k Rad(Si) V 300k Rad(Si) V
Transmit Delay-Max 30 ns 30 ns
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Part Package Code DIP
Pin Count 16
Additional Feature LG_MAX; SEATED HGT-NOM
Package Equivalence Code DIP16,.3

Compare 5962F7802301MEX with alternatives

Compare DS26LS31MJFQML with alternatives