5962-9757701Q2A
vs
5962H9651201QXX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
DEFENSE LOGISTICS AGENCY
AEROFLEX COLORADO SPRINGS
Package Description
CERAMIC, LCC-20
DFP,
Reach Compliance Code
unknown
unknown
Family
F/FAST
AC
JESD-30 Code
S-CQCC-N20
R-CDFP-F14
JESD-609 Code
e0
e0/e4
Length
8.89 mm
9.525 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
20
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
DFP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
FLATPACK
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Propagation Delay (tpd)
7 ns
14 ns
Qualification Status
Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
Seated Height-Max
2.03 mm
2.921 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD/GOLD
Terminal Form
NO LEAD
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Width
8.89 mm
6.2865 mm
Base Number Matches
2
3
Part Package Code
DFP
Pin Count
14
HTS Code
8542.39.00.01
Package Equivalence Code
FL14,.3
Total Dose
1M Rad(Si) V
Compare 5962-9757701Q2A with alternatives
Compare 5962H9651201QXX with alternatives