5962-9560013QXA
vs
5962-9560013QXX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
WHITE ELECTRONIC DESIGNS CORP
MICROSEMI CORP
Package Description
CERAMIC, DIP-32
DIP,
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
15 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T32
R-GDIP-T32
JESD-609 Code
e0
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512KX8
512KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP32,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
Standby Current-Max
0.0045 A
Standby Voltage-Min
2 V
Supply Current-Max
0.18 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
5
4
Part Package Code
DIP
Pin Count
32
Compare 5962-9560013QXA with alternatives
Compare 5962-9560013QXX with alternatives