5962-9466903QZC
vs
SMJ320C40GFS60
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
DIE
PGA
Package Description
DIE,
SPGA, SPGA325,35X35MOD
Pin Count
325
325
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
31
31
Barrel Shifter
YES
YES
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
60 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-XUUC-N325
S-CPGA-P325
JESD-609 Code
e4
e0
Low Power Mode
YES
YES
Number of Terminals
325
325
Operating Temperature-Max
125 °C
100 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIE
SPGA
Package Shape
SQUARE
SQUARE
Package Style
UNCASED CHIP
GRID ARRAY, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
MIL-PRF-38535
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
OTHER
Terminal Finish
GOLD
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
PIN/PEG
Terminal Position
UPPER
PERPENDICULAR
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Pbfree Code
Rohs Code
Integrated Cache
YES
Length
47.245 mm
Number of DMA Channels
6
Number of Timers
2
Package Equivalence Code
SPGA325,35X35MOD
RAM (words)
8192
ROM (words)
4G
Seated Height-Max
5.08 mm
Supply Current-Max
850 mA
Terminal Pitch
1.27 mm
Width
47.245 mm
Compare 5962-9466903QZC with alternatives
Compare SMJ320C40GFS60 with alternatives