5962-9466903QZC
vs
5962-9466904QYC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
DIE
QFP
Package Description
DIE,
GQFF, TPAK352,3.0SQ
Pin Count
325
352
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
31
31
Barrel Shifter
YES
YES
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
60 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-XUUC-N325
S-CQFP-F352
JESD-609 Code
e4
Low Power Mode
YES
YES
Number of Terminals
325
352
Operating Temperature-Max
125 °C
100 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIE
GQFF
Package Shape
SQUARE
SQUARE
Package Style
UNCASED CHIP
FLATPACK, GUARD RING
Qualification Status
Not Qualified
Qualified
Screening Level
MIL-PRF-38535 Class Q
MIL-PRF-38535 Class Q
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
OTHER
Terminal Finish
GOLD
Terminal Form
NO LEAD
FLAT
Terminal Position
UPPER
QUAD
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Pbfree Code
Rohs Code
Integrated Cache
YES
Length
48 mm
Number of DMA Channels
6
Number of Timers
2
Package Equivalence Code
TPAK352,3.0SQ
Peak Reflow Temperature (Cel)
NOT SPECIFIED
RAM (words)
8192
ROM (words)
4G
Seated Height-Max
3.34 mm
Supply Current-Max
850 mA
Terminal Pitch
0.5 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
48 mm
Compare 5962-9466903QZC with alternatives
Compare 5962-9466904QYC with alternatives