5962-9461201HTA
vs
5962-9461201HTC
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
WHITE MICROELECTRONICS
|
Part Package Code |
QFP
|
|
Package Description |
QFF,
|
CERAMIC, QFP-68
|
Pin Count |
68
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.32.00.51
|
|
Access Time-Max |
150 ns
|
150 ns
|
Additional Feature |
USER CONFIGURABLE AS 2M X 8
|
USER CONFIGURABLE AS 2M X 8
|
Alternate Memory Width |
16
|
16
|
JESD-30 Code |
S-CQFP-F68
|
S-CQFP-F68
|
JESD-609 Code |
e0
|
e4
|
Length |
39.625 mm
|
39.625 mm
|
Memory Density |
16777216 bit
|
16777216 bit
|
Memory IC Type |
FLASH MODULE
|
FLASH MODULE
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
68
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
512KX32
|
512KX32
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QFF
|
QFF
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
5 V
|
5 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883
|
MIL-STD-883
|
Seated Height-Max |
3.56 mm
|
3.56 mm
|
Supply Current-Max |
0.24 mA
|
0.24 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
GOLD
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Type |
NOR TYPE
|
NOR TYPE
|
Width |
39.625 mm
|
39.625 mm
|
Base Number Matches |
3
|
2
|
|
|
|
Compare 5962-9461201HTA with alternatives
Compare 5962-9461201HTC with alternatives