5962-9461113HTC
vs
5962-8855210XX
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
WHITE MICROELECTRONICS
|
MICROSS COMPONENTS
|
Package Description |
HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66
|
DIP,
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
25 ns
|
20 ns
|
JESD-30 Code |
S-CPGA-P66
|
R-GDIP-T28
|
JESD-609 Code |
e4
|
|
Length |
27.305 mm
|
|
Memory Density |
16777216 bit
|
262144 bit
|
Memory IC Type |
SRAM MODULE
|
STANDARD SRAM
|
Memory Width |
32
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
66
|
28
|
Number of Words |
524288 words
|
32768 words
|
Number of Words Code |
512000
|
32000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
512KX32
|
32KX8
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
Package Code |
PGA
|
DIP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-PRF-38535
|
MIL-STD-883
|
Seated Height-Max |
4.5974 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
GOLD
|
|
Terminal Form |
PIN/PEG
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
PERPENDICULAR
|
DUAL
|
Width |
27.305 mm
|
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
DIP
|
Pin Count |
|
28
|
|
|
|
Compare 5962-9461113HTC with alternatives
Compare 5962-8855210XX with alternatives