5962-9461110HMC
vs
WS512K32-17G2MA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
AEROFLEX MICROELECTRONIC SOLUTIONS
WHITE ELECTRONIC DESIGNS CORP
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
17 ns
17 ns
I/O Type
COMMON
JESD-30 Code
S-XQFP-G68
S-CQFP-G68
Memory Density
16777216 bit
16777216 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
8
Number of Terminals
68
68
Number of Words
524288 words
2097152 words
Number of Words Code
512000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512KX32
2MX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC
CERAMIC, METAL-SEALED COFIRED
Package Code
QFP
QFP
Package Equivalence Code
QFP68,.99SQ,50
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.028 A
Standby Voltage-Min
2 V
Supply Current-Max
0.7 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Base Number Matches
8
2
Rohs Code
Package Description
22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68
Additional Feature
USER CONFIGURABLE AS 1M X 16 OR 512K X 32
Length
22.4 mm
Number of Functions
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
5.1 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
22.4 mm
Compare 5962-9461110HMC with alternatives
Compare WS512K32-17G2MA with alternatives