5962-9457702QLA
vs
935192630112
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
DEFENSE LOGISTICS AGENCY
|
NXP SEMICONDUCTORS
|
| Package Description |
CERAMIC, DIP-24
|
SOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| Family |
ABT
|
ABT
|
| JESD-30 Code |
R-GDIP-T24
|
R-PDSO-G24
|
| JESD-609 Code |
e0
|
|
| Length |
32.005 mm
|
15.4 mm
|
| Logic IC Type |
REGISTERED BUS TRANSCEIVER
|
REGISTERED BUS TRANSCEIVER
|
| Number of Bits |
8
|
1
|
| Number of Functions |
1
|
8
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT APPLICABLE
|
NOT SPECIFIED
|
| Propagation Delay (tpd) |
6.7 ns
|
5.6 ns
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class Q
|
|
| Seated Height-Max |
5.08 mm
|
2.65 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT APPLICABLE
|
NOT SPECIFIED
|
| Width |
7.62 mm
|
7.5 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
24
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare 5962-9457702QLA with alternatives
Compare 935192630112 with alternatives