Findchips: Compare 5962-9318717HXC vs DPS128C32BV3-35M

5962-9318717HXC vs DPS128C32BV3-35M feature comparison

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Buy Now Datasheet

Part Life Cycle Code	Obsolete	Active
Ihs Manufacturer	AEROFLEX PLAINVIEW	TWILIGHT TECHNOLOGY INC
Part Package Code	PGA	PGA
Package Description	HIP,	PGA,
Pin Count	66	66
Reach Compliance Code	unknown	unknown
ECCN Code	3A001.A.2.C	3A001.A.2.C
HTS Code	8542.32.00.41	8542.32.00.41
Access Time-Max	17 ns	35 ns
JESD-30 Code	S-XHIP-P66	S-CPGA-P66
JESD-609 Code	e4
Length	30.1 mm
Memory Density	4194304 bit	4194304 bit
Memory IC Type	CACHE SRAM MODULE	SRAM MODULE
Memory Width	32	32
Number of Functions	1	1
Number of Terminals	66	66
Number of Words	131072 words	131072 words
Number of Words Code	128000	128000
Operating Mode	ASYNCHRONOUS	ASYNCHRONOUS
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Organization	128KX32	128KX32
Package Body Material	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED
Package Code	HIP	PGA
Package Shape	SQUARE	SQUARE
Package Style	IN-LINE	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL
Qualification Status	Not Qualified	Not Qualified
Screening Level	MIL-PRF-38534 Class Q
Seated Height-Max	6.22 mm	7.62 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	MILITARY	MILITARY
Terminal Finish	GOLD
Terminal Form	PIN/PEG	PIN/PEG
Terminal Pitch	2.54 mm	2.54 mm
Terminal Position	HEX	PERPENDICULAR
Width	30.1 mm
Base Number Matches	3	2
Pbfree Code		No
Rohs Code		No
Additional Feature		CONFIGURABLE AS 512K X 8
Alternate Memory Width		16
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
	Memory » SRAMs	Memory » SRAMs