5962-9318712H5X
vs
5962-9318705HYA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
AEROFLEX COLORADO SPRINGS
MICROSEMI CORP
Part Package Code
PGA
PGA
Package Description
PGA,
HIP,
Pin Count
66
66
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Category CO2 Kg
12
Compliance Temperature Grade
Military: -55C to +125C
Access Time-Max
55 ns
55 ns
JESD-30 Code
S-XPGA-P66
Length
27.3 mm
30.1 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
CACHE SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
66
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX32
128KX32
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
PGA
HIP
Package Shape
SQUARE
Package Style
GRID ARRAY
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38534 Class H
MIL-PRF-38535
Seated Height-Max
4.95 mm
5.84 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
HEX
Width
27.3 mm
30.1 mm
Base Number Matches
1
1
Pbfree Code
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare 5962-9318712H5X with alternatives
Compare 5962-9318705HYA with alternatives