5962-9318709H5C vs 5962-3829413MYX feature comparison

5962-9318709H5C Cobham Advanced Electronic Solutions

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5962-3829413MYX Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer AEROFLEX MICROELECTRONIC SOLUTIONS INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 35 ns
I/O Type COMMON
JESD-30 Code S-XPGA-P66 R-CQCC-N32
Memory Density 4194304 bit 65536 bit
Memory IC Type SRAM MODULE STANDARD SRAM
Memory Width 32 8
Number of Terminals 66 32
Number of Words 131072 words 8192 words
Number of Words Code 128000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX32 8KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC CERAMIC, METAL-SEALED COFIRED
Package Code PGA QCCN
Package Equivalence Code PGA66,11X11
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B MIL-STD-883
Standby Current-Max 0.0116 A
Standby Voltage-Min 2 V
Supply Current-Max 0.6 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form PIN/PEG NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position PERPENDICULAR QUAD
Base Number Matches 1 1
Part Package Code QFJ
Package Description QCCN,
Pin Count 32
Length 13.97 mm
Number of Functions 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 3.048 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.43 mm

Compare 5962-9318709H5C with alternatives

Compare 5962-3829413MYX with alternatives