5962-9318708HXA
vs
5962-9318701HYX
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
WHITE MICROELECTRONICS
Part Package Code
PGA
Package Description
HIP,
Pin Count
66
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
120 ns
JESD-609 Code
e0
Length
30.1 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
CACHE SRAM MODULE
SRAM MODULE
Memory Width
32
8
Number of Functions
1
1
Number of Words
131072 words
524288 words
Number of Words Code
128000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX32
512KX8
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
HIP
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
MIL-PRF-38535
Seated Height-Max
6.22 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
Terminal Position
HEX
HEX
Width
30.1 mm
Base Number Matches
6
2
Additional Feature
USER CONFIGURABLE AS 128K X 32
Alternate Memory Width
16
JESD-30 Code
S-CHIP-P66
Number of Terminals
66
Package Shape
SQUARE
Compare 5962-9318708HXA with alternatives
Compare 5962-9318701HYX with alternatives