5962-9318701HYX vs 5962-9318710HTA feature comparison

5962-9318701HYX White Microelectronics

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5962-9318710HTA Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WHITE MICROELECTRONICS MICROSEMI CORP
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 120 ns 17 ns
Additional Feature USER CONFIGURABLE AS 128K X 32 CONFIGURABLE AS 512K X 8
Alternate Memory Width 16 16
JESD-30 Code S-CHIP-P66
Memory Density 4194304 bit 4194304 bit
Memory IC Type SRAM MODULE CACHE SRAM MODULE
Memory Width 8 32
Number of Functions 1 1
Number of Terminals 66
Number of Words 524288 words 131072 words
Number of Words Code 512000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512KX8 128KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package Shape SQUARE
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 MIL-PRF-38535
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form PIN/PEG PIN/PEG
Terminal Position HEX HEX
Base Number Matches 2 6
Pbfree Code No
Part Package Code PGA
Package Description HIP,
Pin Count 66
JESD-609 Code e0
Length 30.1 mm
Package Code HIP
Seated Height-Max 6.22 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 30.1 mm

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