5962-9318707H4A
vs
WS128K32N-35HME
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROSS COMPONENTS
WHITE MICROELECTRONICS
Part Package Code
PGA
Package Description
PGA, PGA66,11X11
Pin Count
66
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
Additional Feature
ALSO CONFIGURABLE AS 512K X 8
USER CONFIGURABLE AS 128K X 32
Alternate Memory Width
16
16
I/O Type
COMMON
JESD-30 Code
S-XPGA-P66
S-CHIP-P66
Length
27.305 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
8
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
131072 words
524288 words
Number of Words Code
128000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX32
512KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
Package Equivalence Code
PGA66,11X11
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
4.953 mm
Standby Current-Max
0.0116 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.6 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
Terminal Position
PERPENDICULAR
HEX
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
27.305 mm
Base Number Matches
8
2
Number of Ports
1
Output Enable
YES
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