5962-9318705HYA vs 5962-9318712H5X feature comparison

5962-9318705HYA Microsemi Corporation

Buy Now

5962-9318712H5X Cobham Semiconductor Solutions

Buy Now
Pbfree Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP AEROFLEX COLORADO SPRINGS
Part Package Code PGA PGA
Package Description HIP, PGA,
Pin Count 66 66
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-609 Code e0
Length 30.1 mm 27.3 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type CACHE SRAM MODULE STANDARD SRAM
Memory Width 32 32
Number of Functions 1 1
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX32 128KX32
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code HIP PGA
Package Style IN-LINE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 MIL-PRF-38534 Class H
Seated Height-Max 5.84 mm 4.95 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position HEX PERPENDICULAR
Width 30.1 mm 27.3 mm
Base Number Matches 1 1
JESD-30 Code S-XPGA-P66
Number of Terminals 66
Package Shape SQUARE

Compare 5962-9318705HYA with alternatives

Compare 5962-9318712H5X with alternatives