5962-9318705HYA
vs
5962-8993501XA
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROSEMI CORP
PYRAMID SEMICONDUCTOR CORP
Part Package Code
PGA
DIP
Package Description
HIP,
DIP, DIP28,.3
Pin Count
66
28
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
45 ns
JESD-609 Code
e0
e0
Length
30.1 mm
37.0205 mm
Memory Density
4194304 bit
262144 bit
Memory IC Type
CACHE SRAM MODULE
STANDARD SRAM
Memory Width
32
4
Number of Functions
1
1
Number of Words
131072 words
65536 words
Number of Words Code
128000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX32
64KX4
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
HIP
DIP
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
38535Q/M;38534H;883B
Seated Height-Max
5.84 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
PIN/PEG
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
HEX
DUAL
Width
30.1 mm
7.62 mm
Base Number Matches
1
1
Rohs Code
Additional Feature
AUTOMATIC POWER-DOWN
I/O Type
SEPARATE
JESD-30 Code
R-GDIP-T28
Number of Terminals
28
Output Characteristics
3-STATE
Package Equivalence Code
DIP28,.3
Package Shape
RECTANGULAR
Standby Current-Max
0.02 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.13 mA
Compare 5962-9318705HYA with alternatives
Compare 5962-8993501XA with alternatives