5962-9317703MZX
vs
MMDP-67206FV-30/883
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TELEDYNE E2V (UK) LTD
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DFP
|
|
| Package Description |
DFP,
|
0.400 INCH, FP-28
|
| Pin Count |
28
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
20 ns
|
30 ns
|
| Cycle Time |
30 ns
|
40 ns
|
| JESD-30 Code |
R-GDFP-F28
|
R-CDFP-F28
|
| Memory Density |
147456 bit
|
147456 bit
|
| Memory Width |
9
|
9
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Number of Words |
16384 words
|
16384 words
|
| Number of Words Code |
16000
|
16000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
16KX9
|
16KX9
|
| Output Enable |
NO
|
NO
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
MIL-STD-883 Class B
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
| Length |
|
18.288 mm
|
| Memory IC Type |
|
OTHER FIFO
|
| Package Equivalence Code |
|
FL28,.4
|
| Seated Height-Max |
|
3.3 mm
|
| Standby Current-Max |
|
0.005 A
|
| Supply Current-Max |
|
0.11 mA
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
10.16 mm
|
|
|
|
Compare 5962-9317703MZX with alternatives
Compare MMDP-67206FV-30/883 with alternatives