MMDP-67206FV-30/883
vs
5962-9317702VNX
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
0.400 INCH, FP-28
|
0.400 INCH, FP-28
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
30 ns
|
30 ns
|
Cycle Time |
40 ns
|
40 ns
|
JESD-30 Code |
R-CDFP-F28
|
R-XDFP-F28
|
Length |
18.288 mm
|
18.288 mm
|
Memory Density |
147456 bit
|
147456 bit
|
Memory IC Type |
OTHER FIFO
|
OTHER FIFO
|
Memory Width |
9
|
9
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Number of Words |
16384 words
|
16384 words
|
Number of Words Code |
16000
|
16000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
16KX9
|
16KX9
|
Output Enable |
NO
|
NO
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
Package Code |
DFP
|
DFP
|
Package Equivalence Code |
FL28,.4
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLATPACK
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B
|
MIL-PRF-38535 Class V
|
Seated Height-Max |
3.3 mm
|
3.3 mm
|
Standby Current-Max |
0.005 A
|
|
Supply Current-Max |
0.11 mA
|
0.11 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
10.16 mm
|
10.16 mm
|
Base Number Matches |
3
|
3
|
|
|
|
Compare MMDP-67206FV-30/883 with alternatives
Compare 5962-9317702VNX with alternatives